ASUS TUF Gaming Radeon™ RX 9070 OC Edition 16GB GDDR6
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TUF-RX9070-O16G-GAMING
Modelo
TUF-RX9070-O16G-GAMING
GPU
AMD Radeon™ RX 9070
Barramento Padrão
PCI Express 5.0
OpenGL
OpenGL®4.6
Memória de Vídeo
16GB GDDR6
Clock
OC mode(GPU Tweak III): up to 2670 MHz (Boost Clock)/up to 2190 MHz (Game Clock)
Default mode: up to 2650 MHz (Boost Clock)/up to 2170MHz (Game Clock)
Stream Processors
3584
Velocidade de Memória
20 Gbps​
Interface de Memória
256-bit
Resolução
Resolução Máx Digital 7680 x 4320
Interface
Yes x 1 (Native HDMI 2.1b)
Yes x 3 (Native DisplayPort 2.1a)
Suporte HDCP: Sim (2.3)
Suporte Máximo de Telas
4
Suporte NVlink/ Crossfire
Não
Acessórioses
1 x TUF certificate of Reliability
1 x TUF Gaming Graphics Card Holder
1 x TUF Velcro Hook & Loop
1 x TUF Fridge Magnet
1 x Thank you card
1 x Speedsetup Manual
Software
ASUS GPU Tweak III & Drivers: baixe todos os softwares do site de suporte.
Dimensões
330 x 140 x 62.5 mm
13 x 5.5 x 2.5 inch
PSU Recomendada
750W
Conectores de Energia
2 x 8-pinos
Slot
3.125 Slot
AURA SYNC
RGB
Nota
* Our wattage recommendation is based on a fully overclocked GPU and CPU system configuration. For a more tailored suggestion, please use the “Choose By Wattage” feature on our PSU product page: http://rog.stzgcm.com/event/PSU/ASUS-Power-Supply-Units/index.html
* All specifications are subject to change without notice. Please check with your supplier for exact offers. Products may not be available in all markets. If you do not use the latest and current specifications of ASUS products, you shall be liable for all loss and damage claimed by third party to ASUS based on false advertising or any other issues caused from using false specifications of ASUS products.
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.